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ASML HOLDING NV (ASML)

20-F · FY2025 · Filed Feb 25, 2026

Accession: 0001628280-26-011378

ASML HOLDING NV (ASML)'s FY2025 20-F was filed with the SEC on (accession 0001628280-26-011378). Per Item 1 of the filing, its products include TWINSCAN EXE:5200B, TWINSCAN NXE:3800E, TWINSCAN XT:260, TWINSCAN NXTi platform (e.g., NXT:2150i, NXT:2100i, NXT:1980Fi) and TWINSCAN NXT:870B (KrF dry); it names Canon (Canon Kabushiki Kaisha) - DUV lithography, Nikon (Nikon Corporation) - DUV lithography, Applied Materials Inc. - patterning applications and KLA-Tencor Corporation - metrology and inspection / patterning applications among its competitors; customer segments: Logic / Foundry (advanced node and mainstream), Memory - DRAM (incl. high-bandwidth memory and DDR5 for AI), Memory - NAND Flash, Integrated Device Manufacturers (IDMs) and Fab-less / contract foundry customers.

Item 1 — Business overview

Products

  • TWINSCAN EXE:5200B (EUV 0.55 NA / High NA)
  • TWINSCAN EXE:5000A (EUV 0.55 NA)
  • TWINSCAN NXE:3800E (EUV 0.33 NA)
  • TWINSCAN NXE:3600D
  • TWINSCAN NXT:2150i (ArF immersion)
  • TWINSCAN NXT:2100i (ArF immersion)
  • TWINSCAN NXT:1980Fi/Ei/Di (ArF immersion)
  • TWINSCAN NXT:870B (KrF dry)
  • TWINSCAN XT:260 (i-line, advanced packaging)
  • PAS 5500 (legacy lithography)
  • YieldStar 550 (optical metrology)
  • YieldStar 1390 (optical metrology)

Product categories

  • EUV lithography systems (0.33 NA and 0.55 NA High NA)
  • DUV immersion lithography systems (ArF immersion / TWINSCAN NXTi)
  • DUV dry lithography systems (ArF dry, KrF, i-line / TWINSCAN NXT and XT)
  • Metrology and inspection systems (YieldStar optical, HMI e-beam, multibeam)
  • Computational lithography software
  • System and process control software
  • Service, field options and refurbished systems / installed base management

Customer segments

  • Logic / Foundry (advanced node and mainstream)
  • Memory - DRAM (incl. high-bandwidth memory and DDR5 for AI)
  • Memory - NAND Flash
  • Integrated Device Manufacturers (IDMs)
  • Fab-less / contract foundry customers
  • Mainstream / 'More than Moore' chipmakers (automotive, consumer, sensors)

Go to market

  • Direct sales and customer team model led by Chief Customer Officer Jim Koonmen, with cross-functional teams embedded with each major customer
  • Volume Purchase Agreements (VPAs) covering up to five years with chipmakers
  • Around 10,000 customer support employees providing 24/7 service in customer fabs (installation, service, upgrades, applications)
  • Long-term installed-base management: service contracts, productivity/lifetime extension packages (PEPs, LEPs, SNEPs) and field upgrades
  • Refurbishment and resale of used systems (>600 refurbished systems shipped to date) to extend product life
  • Co-development with customers, suppliers (incl. Carl Zeiss) and research institutes (imec, TNO, ARCNL, TU/e) within an open innovation ecosystem
  • Subject to export control regimes (Netherlands, EU, US) – EUV and certain advanced DUV immersion systems require export licenses

Named competitors

  • Canon (Canon Kabushiki Kaisha) - DUV lithography
  • Nikon (Nikon Corporation) - DUV lithography
  • Applied Materials Inc. - patterning applications
  • KLA-Tencor Corporation - metrology and inspection / patterning applications

Raw Item 1 preview

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