Structured SEC filing viewer
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD (TSM)
20-F · FY2025 · Filed Apr 16, 2026
Accession: 0001628280-26-025362
Item 1 — Business overview
Products
- 2-nanometer (N2) Nanosheet logic process
- 2-nanometer Nanosheet Plus (N2P)
- 2-nanometer N2X (HPC-focused variant)
- 3-nanometer FinFET (N3)
- 3-nanometer FinFET Enhanced (N3E)
- 3-nanometer FinFET Plus (N3P)
- 3-nanometer FinFET Compact (N3C)
- 3-nanometer FinFET Automotive (N3A)
- 3-nanometer N3X (HPC-focused variant)
- 4-nanometer FinFET Plus (N4P)
- 4-nanometer FinFET Compact (N4C)
- 4-nanometer N4X (HPC-focused variant)
Product categories
- Wafer fabrication (logic CMOS)
- Mixed-signal/RF semiconductors
- Embedded memory
- MEMS
- BiCMOS
- Advanced packaging (CoWoS, InFO, SoIC)
- Mask making
- Design services
- Testing services
- Specialty technologies (RF, eNVM, PMIC, CIS, sensors)
Customer segments
- High Performance Computing (HPC) including AI accelerators, GPUs, CPUs, FPGAs, server processors
- Smartphone
- Internet of Things (IoT) / AIoT / Edge AI
- Automotive (ADAS, IVI, EVs, ICEs)
- Digital Consumer Electronics (DTV, STB, cameras)
- Fabless semiconductor companies
- System companies (designing own semiconductors)
- Integrated device manufacturers (IDMs)
Go to market
- Direct sales to fabless semiconductor companies, system companies, and IDMs
- Worldwide customer support via subsidiaries in U.S., Canada, Japan, China, Germany, Netherlands, South Korea
- Web-based applications for real-time customer interaction (design, engineering, logistics)
- Open Innovation Platform (OIP) ecosystem with EDA and IP partners
- CyberShuttle multi-project wafer program for cost-shared prototyping
- Long-term capacity reservation agreements with advance temporary receipts from customers
- Annual customer satisfaction surveys
Named competitors
- Other dedicated foundries
- Integrated device manufacturers (IDMs)
Raw Item 1 preview
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