Equipment
3 reportable
Lithography, deposition, metrology — the toolmakers fabs depend on.
EvidInvest Supply Chain Intelligence
Compute supply-chain bottlenecks determine who can ship AI products: lithography, foundry capacity, CoWoS packaging, HBM, optical links, networking silicon, and hyperscaler custom-ASIC partnerships all decide whether model demand converts into deployable accelerator clusters.
02 / Methodology
Pass 1 bootstraps the graph with web-cited relationships. Pass 2 enriches each eligible issuer from its latest 10-K or 20-F using Opus 4.7, extracting products, customers, suppliers, and filing-anchored edge evidence. Pass 3 recursively runs the same SEC extraction on newly discovered listed companies, but only when they remain connected to the AI-datacenter tier taxonomy.
Confidence is explicit: cited edges carry a source URL or SEC accession and evidence quote, while inferred or contested links remain labelled as such in the graph.
03 / Stack
3 reportable
Lithography, deposition, metrology — the toolmakers fabs depend on.
3 reportable
Wafer manufacturing at the leading edge.
2 reportable
Outsourced assembly, test, and advanced packaging (CoWoS, FOPLP).
3 reportable
DRAM and HBM stacks attached to every accelerator.
1 reportable
Architectural IP licensed across the stack.
8 reportable
Fabless GPU/CPU/ASIC designers monetising the stack above.
4 reportable
Transceivers, lasers, silicon photonics for AI fabrics.
6 reportable
Datacenter Ethernet/InfiniBand switching silicon and systems.
5 reportable
AI server builders integrating accelerators, memory, networking.
7 reportable
Cloud + custom-silicon owners — the demand pull at the top.
3 reportable
AI labs and large enterprise consumers buying compute capacity.
04 / Company Profiles
3 reportable companies
ASML · $732.1B
TWINSCAN EXE:5200B: Second-generation High NA EUV (0.55 NA) lithography system released in full spec to first customer in 2025; ~175 wph and ~60% higher productivity than EXE:5000, intended for high-volume manufacturing of leading-edge logic and DRAM.
Largest customer (unnamed in filing) · 23.9% of FY2025 net sales (€7,796.7m)
“Total net sales to our largest customer amounted to €7,796.7 million, or 23.9% of total net sales in 2025, compared with €4,682.4 million, or 16.6% of total net sales in 2024. In 2025, 38.0% of total net sales were made to our two largest customers.”
Carl Zeiss SMT GmbH (subsidiary of Carl Zeiss AG) · Sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components for ASML lithography systems; ASML holds a 24.9% equity interest in Carl Zeiss SMT Holding GmbH & Co. KG and provides multi-billion euro R&D funding and loans (incl. €1bn 2021 loan, €1bn 2024 loan, additional 2025 loans). Total purchases €4.4bn in 2025.
“The number of lithography systems we are able to produce is limited by the production capacity of one of our key suppliers, Carl Zeiss SMT, our sole supplier of lenses, mirrors, illuminators, collectors and other critical optical components (which we refer to as optics). We have an exclusive arrangement with Carl Zeiss SMT.”
KEYS · $58.1B
Spectrum and Signal Analyzers: Products providing detailed analysis of complex communications and radar signals across radio frequency, microwave, and optical frequencies.
No named customer extracted.
No named supplier extracted.
VIAV · $12.3B
Optical Variable Pigment (OVP) / OVMP: Color-shifting (OVP) and depth/motion-effect (OVMP) security pigments formulated into inks used by banknote issuers and security printers; deployed on banknotes of more than 100 countries.
SICPA Holding SA · One OSP customer generated $166.7M, >10% of total net revenue in FY2025
“One customer of the Company in the OSP segment generated $166.7 million, $154.1 million and $157.7 million of net revenue, which represented more than 10% of total net revenue, during fiscal 2025, 2024 and 2023, respectively.”
Keysight Technologies, Inc. · Seller/counterparty in pending $425M acquisition of Spirent HSE, network security and CE businesses for NSE
“the Company entered into a purchase agreement to acquire Spirent Communications plc's (Spirent) high-speed ethernet and network security business lines ... from Keysight Technologies, Inc. for our NSE segment. The total purchase consideration of $425 million will be paid at closing”
3 reportable companies
TSM · $2.2T
N2 (2-nanometer Nanosheet): Most advanced node entering volume production in 2025; nanosheet transistor architecture targeting HPC and premium smartphones.
Customer A (largest customer, undisclosed) · 19%
“Our largest customer in 2023, 2024 and 2025 accounted for 25%, 22% and 19% of our net revenue in the respective year.”
Silicon wafer suppliers (Taiwan, Japan, Germany, Singapore) · Primary raw material suppliers for silicon wafers under long-term agreements
“In pursuit of high quality raw wafers, the majority of our raw wafers are supplied by a limited number of suppliers located in Taiwan, Japan, Germany, and Singapore.”
INTC · $587.8B
Intel Core Ultra Series 3 (Panther Lake): First mobile processors built on Intel 18A process technology with RibbonFET gate-all-around transistors and PowerVia backside power delivery; targets next-gen AI PCs.
Dell Inc. · 19%
“Customer A 19% 19% 19%... Our three largest customers accounted for 43% of our net revenue in 2025, 45% of our net revenue in 2024 and 40% of our net revenue in 2023.”
ASML Holding N.V. · Sole supplier of EUV lithography tools required for Intel 4, Intel 3, Intel 18A and future leading-edge nodes; also supplies high-NA EUV for Intel 14A development
“ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.”
2 reportable companies
ASX · $80.7B
FOCoS / FOCoS-Bridge: Fanout Chip-on-Substrate with optional silicon bridge for die-to-die interconnect; used for ASIC + HBM integration in HPC, AI/ML, networking and server applications.
Undisclosed >10% customer (Customer One) · >10%
“One customer (including other customers for whom OEM services were provided on its behalf) accounted for more than 10.0% of our operating revenues in 2023, 2024, and 2025.”
Kinsus Interconnect Technology Corporation · Key IC substrate supplier (limited number of substrate suppliers globally)
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”
AMKR · $18.9B
SWIFT: High density fan-out (HDFO) packaging technology that replaces or thins the laminate substrate, enabling high performance in compact form factors for HPC and AI applications.
Apple · 29.8%
“Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
U.S. Department of Commerce · CHIPS Act funding partner — up to $407 million in direct funding for Arizona Facility
“In December 2024, the Commerce Department awarded us up to $407 million in direct funding pursuant to the CHIPS Act for the Arizona Facility.”
3 reportable companies
MU · $1.1T
HBM3E 12-high (36GB): High-bandwidth memory using 1-beta DRAM with TSV stacking; majority of HBM shipments by Q4 2025, powering AI accelerators in data centers.
Undisclosed customer (CMBU-concentrated) · 17%
“Revenue from one customer was 17% (primarily included in the CMBU segment) of total revenue for 2025.”
No named supplier extracted.
1 reportable companies
ARM · $364.1B
Armv9 architecture: Latest generation Arm instruction set architecture with added AI acceleration features and instructions; foundation for current CPU and GPU products targeting future AI workloads.
Arm China (Arm Technology (China) Co. Limited) · 17%
“our largest customer individually, Arm China, accounted for approximately 17%, 21% and 24% of our total revenue, respectively, during those fiscal years.”
Cadence Design Systems · Third-party EDA tools partner; also acquirer of Arm's Artisan foundation IP business (April 2025)
“Many of our customers utilize third-party vendors for EDA tools... we entered into a definitive agreement with Cadence to sell our Artisan foundation IP business... for total gross consideration of approximately $150.0 million.”
8 reportable companies
NVDA · $5.0T
NVIDIA Blackwell platform: Data-center-scale GPU architecture connecting 36 Grace CPUs and 72 Blackwell GPUs in a liquid-cooled design for trillion-parameter inference and training; majority of FY26 Data Center revenue.
Direct Customer A (undisclosed) · 22%
“For fiscal year 2026, sales to one direct customer represented 22% of total revenue ... primarily attributable to the Compute & Networking segment.”
Taiwan Semiconductor Manufacturing Company (TSMC) · Primary foundry for semiconductor wafer fabrication, including CoWoS packaging
“We utilize foundries, such as Taiwan Semiconductor Manufacturing Company Limited, or TSMC, and Samsung Electronics Co., Ltd., or Samsung, to produce our semiconductor wafers.”
AVGO · $1.8T
VMware Cloud Foundation (VCF): Integrated enterprise-class compute, networking, storage, management, and security platform with native Kubernetes for virtual machines and containerized workloads, including private AI capabilities.
Unnamed top semiconductor distributor · 32%
“Direct sales to one semiconductor solutions customer, which is a distributor, accounted for 32% and 28% of our net revenue for fiscal years 2025 and 2024, respectively.”
Taiwan Semiconductor Manufacturing Company Limited · Primary wafer foundry — ~95% of CM-manufactured wafers
“During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC. We believe our wafer requirements represent a meaningful portion of TSMC's total production capacity.”
AMD · $796.5B
AMD Instinct MI350 Series GPUs: Data center AI accelerator GPUs based on AMD CDNA architecture for AI training, inference and exascale-class scientific computing; deployed by hyperscalers, OEMs and ODMs in 2025.
OpenAI OpCo, LLC
“In October 2025, we entered into a product purchase agreement with OpenAI OpCo, LLC, (OpenAI) to deploy 6 gigawatts of AMD GPUs, with the deployment of the first gigawatt of capacity powered by our AMD Instinct MI450 series products.”
Taiwan Semiconductor Manufacturing Company (TSMC) · Primary wafer foundry for HPC, FPGA and adaptive SoC products at 7nm and smaller nodes
“We rely on Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the production of all wafers for microprocessor and GPU products at 7 nanometer (nm) or smaller nodes.”
INTC · $587.8B
Intel Core Ultra Series 3 (Panther Lake): First mobile processors built on Intel 18A process technology with RibbonFET gate-all-around transistors and PowerVia backside power delivery; targets next-gen AI PCs.
Dell Inc. · 19%
“Customer A 19% 19% 19%... Our three largest customers accounted for 43% of our net revenue in 2025, 45% of our net revenue in 2024 and 40% of our net revenue in 2023.”
ASML Holding N.V. · Sole supplier of EUV lithography tools required for Intel 4, Intel 3, Intel 18A and future leading-edge nodes; also supplies high-NA EUV for Intel 14A development
“ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.”
MRVL · $245.6B
Custom ASICs (5nm/3nm/2nm): Customer-specific SoCs for AI accelerators and data center compute, leveraging Marvell's SerDes, ARM compute, security, silicon photonics and advanced packaging IP.
Customer A (undisclosed direct customer) · 14%
“Customer A 14% 13% * ... Direct Customer”
Taiwan-based foundries (unnamed) · Primary wafer foundry partners
“Most of our products are manufactured by third-party foundries located in Taiwan, and other sources are located in China, Germany, South Korea, Singapore and the United States.”
QCOM · $213.9B
Snapdragon mobile platforms: Highly-integrated SoC platforms (CPU, GPU, NPU, modem, RF) powering premium-to-entry Android handsets; QCT's flagship product line.
Apple · 10%+
“In fiscal 2025, revenues from Apple, Samsung and Xiaomi each comprised 10% or more of our consolidated revenues.”
Taiwan Semiconductor Manufacturing Company (TSMC) · Primary foundry supplier for digital, analog/mixed-signal, RF and PM ICs
“The primary foundry suppliers for our various digital, analog/mixed-signal, RF and PM integrated circuits include Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics and Global Foundries.”
MTSI · $28.6B
GaN-on-Silicon Carbide RF & microwave products: Portfolio of GaN on Silicon Carbide products for high-performance RF and microwave applications, acquired via the Wolfspeed RF Business and produced at the RTP, North Carolina fab.
Customer A (unnamed reseller) · 12.4% (FY2025); 12% per segment note
“One of our resellers accounted for 12.4% and 11.3% of our revenue in fiscal years 2025 and 2024, respectively, but did not exceed 10% in fiscal year 2023.”
Wolfspeed, Inc. · Seller of the acquired RF Business; operated RTP fab and supplied wafer product and fabrication services prior to the July 2025 fab transfer
“Prior to the RTP Fab Transfer, the Seller continued to operate the facility and supply wafer product and other fabrication services to us pursuant to various agreements entered into between the parties concurrently with the closing of the RF Business Acquisition.”
4 reportable companies
GLW · $151.9B
Corning Gorilla Glass: Chemically strengthened thin cover/back-enclosure glass for mobile phones, tablets, laptops and smartwatches; durable, optically clear with touch and RF transparency.
Apple
“We collaborated with Apple to deliver durable glass with infused color for the back of Apple's iPhone 15 and iPhone 15 Plus devices. These devices also feature Ceramic Shield, a highly transparent, color-free glass-ceramic”
No named supplier extracted.
LITE · $69.2B
Cloud Networking optical components: Optical components and transceivers serving cloud and datacom customers; segment revenue reported under Cloud Networking, expanded via the CloudLight acquisition.
Huawei
“us-gaap:CorporateNonSegmentMember lite:HuaweiMember 2024-06-30 2025-06-28 (filing references Huawei in segment-level disclosure)”
Sumitomo Mitsui Banking Corporation · secured term loan lender (Japan)
“lite:SumitomoMitsuiBankingCorporationMember us-gaap:SecuredDebtMember 2024-08-09 ... 2025-06-28”
COHR · $57.7B
800G/1.6T Datacom Transceivers: Protocol-agnostic high-speed optical transceivers supporting Ethernet, InfiniBand and NVIDIA NVLink for AI/ML datacenter buildouts; complete vertical integration from VCSELs/EMLs to modules.
Unnamed Major Customer #1 · 12%
“We had two customers who each contributed more than 10% of revenue during fiscal 2025... These customers purchased primarily from our Networking segment.”
No named supplier extracted.
AAOI · $13.9B
Quantum Bandwidth CATV equipment: Company-branded CATV products (amplifiers, nodes, transmitters) sold directly to MSOs to support DOCSIS 4.0 network upgrades; meets DOCSIS 4.0 standards on nearly all 2025 CATV equipment.
Digicomm · 53.1%
“In 2025, 2024, and 2023, Digicomm accounted for 53.1%, 34.1% and 11.3% of our revenue, respectively”
No named supplier extracted.
6 reportable companies
CSCO · $480.2B
Catalyst 9000 Switches: Flagship campus switching family with embedded Cisco DNA software subscription providing automation, analytics, and security for converged data, voice, video, and IoT.
Webscale providers
“The revenue increase in our service provider and cloud market was driven by AI infrastructure revenue from webscale customers.”
Unnamed long-term supply supplier · Long-term component supply arrangement; subject of August 2025 legal settlement and ~$355M Q4 charge
“On August 26, 2025, we settled a legal dispute with a supplier relating to purchase obligations arising under long-term supply arrangements, which resulted in a charge to product cost of sales.”
ANET · $196.9B
Arista EOS (Extensible Operating System): State-oriented network operating system running on standard Linux that powers all Arista platforms and provides programmability via a centralized publish/subscribe database.
End customer A (undisclosed, 26% of revenue) · 26%
“sales to the other end customer represented 26%, 20%, and 18% of our total revenue for the years ended December 31, 2025, 2024, and 2023, respectively.”
Broadcom · Predominant merchant silicon vendor for switching chips
“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”
APH · $187.6B
High-speed interconnect products: Industry-leading high-speed interconnect technologies enabling IT datacom systems including servers, networking equipment and AI/machine learning applications.
No named customer extracted.
No named supplier extracted.
CIEN · $63.0B
6500 Packet-Optical Platform: Multi-layer transport solution adding capacity to core, regional, metro and submarine networks with coherent wavelength capacities and a flexible photonic layer.
Unnamed cloud provider · $851.6M, 17.9% of total revenue (FY2025)
“Sales to one cloud provider were $851.6 million, or 17.9% of total revenue in fiscal 2025 and $532.3 million or 13.3% of total revenue in fiscal 2024.”
No named supplier extracted.
ALAB · $63.0B
Aries PCIe/CXL Smart DSP Retimers: Smart DSP retimers that digitally recover degraded high-speed signals and retransmit a clean copy, extending interconnect reach and enabling higher PCIe/CXL bandwidth and lower latency. Historically the largest revenue product family.
Amazon (Amazon.com NV Investment Holdings LLC)
“In October 2022, the Company issued a warrant to Amazon NV Investment Holdings LLC ("Holder") to purchase an aggregate of up to 1,484,230 shares of Common Stock at an exercise price of $20.34 per share (the "Customer Warrant").”
TSMC · Sole foundry for all integrated circuits (fabless model)
“We use a fabless manufacturing model and partner with TSMC to fabricate all of our ICs.”
CRDO · $48.8B
HiWire AECs: Distinctive purple plug-and-play copper Active Electrical Cables for lossless 100G–1.6T operation; the CLOS, SPAN, SHIFT and SWITCH families connect GPUs to network switches in AI racks, drove >95% of fiscal 2025 product sales growth.
Amazon.com NV Investment Holdings LLC (Amazon)
“the Company issued a warrant to Amazon.com NV Investment Holdings LLC (Holder) to purchase an aggregate of up to 4.1 million of our ordinary shares... The shares issuable vest in tranches over the contract term based on the amount of global payments by Holder and its affiliates to the Company, up to $201.0 million in aggregate payments.”
Taiwan Semiconductor Manufacturing Company Limited (TSMC) · Exclusive / sole wafer foundry for all ICs
“In fiscal year 2025, we exclusively used Taiwan Semiconductor Manufacturing Company Limited (TSMC) for semiconductor wafer production.”
5 reportable companies
DELL · $260.2B
AI-Optimized Servers (ISG): Servers engineered for AI training and inference workloads, broken out as a separate revenue line within Infrastructure Solutions Group.
Undisclosed customer (>10% of net revenue) · >10%
“XBRL tag dell:OneCustomerMember us-gaap:CustomerConcentrationRiskMember us-gaap:SalesRevenueNetMember indicates one customer was a >10% concentration of net revenue for FY2026.”
Three largest contract manufacturers (unnamed in visible text) · Concentration of accounts payable / production with three largest contract manufacturers
“XBRL tag dell:ThreeLargestContractManufacturersMember discloses concentration with the three largest contract manufacturers as of 2026-01-30 and 2025-01-31.”
HPE · $62.0B
HPE GreenLake: Hybrid cloud platform delivering as-a-service consumption with pay-per-use and automated scalability across public clouds, data centers, colocation, and edge.
Unnamed distributor (Customer One) · ~10%
“The Company had one distributor which represented approximately 10% of the Company's total net revenue in fiscal 2025, primarily within the Server and Networking segments.”
Intel · Single-source supplier of certain x86 processors
“our single-source suppliers (e.g., Intel and AMD as suppliers of certain x86 processors Broadcom and others for industry standard Application-Specific Standard Product, or NVIDIA for Graphics Processing Units)”
FN · $20.9B
Reconfigurable Optical Add-Drop Multiplexers (ROADMs): Selective switching products that route voice, video and data traffic through fiber optic cables at various wavelengths, speeds, and distances. Core optical communications product.
NVIDIA Corporation · 27.6%
“During fiscal year 2025, NVIDIA Corporation and Cisco Systems, Inc. contributed 27.6% and 18.2%, respectively, of our revenues.”
No named supplier extracted.
SMCI · $19.2B
DCBBS (Data Center Building Block Solutions): Integrated offering that simplifies deployment of liquid-cooled AI factories, including servers, storage, networking, racks, liquid cooling infrastructure, software, services, and support.
Customer A (undisclosed) · 20.9%
“Customer A 20.9% [of total net sales]... Customer A 33.4% [of accounts receivable]”
Supplier A (undisclosed) · Largest supplier, 64.4% of total purchases FY2025
“Supplier A 64.4% [of total purchases FY2025]”
7 reportable companies
AAPL · $4.3T
iPhone: Apple's smartphone line based on iOS; FY25 lineup includes iPhone 17 Pro, iPhone Air, iPhone 17, iPhone 16 and iPhone 16e. Largest revenue category at $209.6B in 2025.
Cellular network carriers (aggregate) · 34% of trade receivables
“The Company's third-party cellular network carriers accounted for 34% and 38% of total trade receivables as of September 27, 2025 and September 28, 2024, respectively.”
Vendor One (unnamed) · Largest single concentration: 46% of vendor non-trade receivables
“As of September 27, 2025, the Company had two vendors that individually represented 10% or more of total vendor non-trade receivables, which accounted for 46% and 23%.”
GOOGL · $4.3T
Google Search: Core search engine with trillions of queries annually, now augmented with AI Overviews and AI Mode powered by Gemini for natural-language and multimodal queries.
No named customer extracted.
No named supplier extracted.
MSFT · $2.9T
Azure: Comprehensive set of cloud services for compute, networking, storage, AI, IoT, and machine learning, delivered through global datacenter network. Azure OpenAI Service is exclusive on Azure.
No named customer extracted.
Dell · Multinational OEM distribution partner for Windows
“We have distribution agreements covering one or more of our products with virtually all the multinational OEMs, including Dell, Hewlett-Packard, Lenovo, and with many regional and local OEMs.”
AMZN · $2.6T
Amazon Web Services (AWS): Broad set of on-demand cloud technology services including compute, storage, database, analytics, AI and machine learning. $128.7B in FY2025 net sales, 20% YoY growth.
Anthropic, PBC
“We also have a commercial arrangement primarily for the provision of AWS cloud services, which includes the use of AWS chips.”
No named supplier extracted.
META · $1.4T
Facebook: Flagship social network for sharing life moments, communities, Feed, Reels, Stories, Groups, and Marketplace; one of two primary ad-revenue products.
No named customer extracted.
Apple · Mobile OS / App Store distribution partner; iOS changes materially affect Meta's ad targeting and measurement
“Apple made certain changes to its products and data use policies in connection with changes to its iOS operating system that reduce our and other iOS developers' ability to target and measure advertising.”
ORCL · $529.5B
Oracle Cloud Infrastructure (OCI): Oracle's IaaS/PaaS platform delivering compute, storage, networking, AI infrastructure and database services; includes multicloud and dedicated region variants.
TikTok
“the U.S. enacted a law making it unlawful, beginning in January 2025, to provide internet hosting services to TikTok... If the prohibition is lifted... we may no longer be able to provide those services to TikTok... our revenues and profits would be adversely impacted.”
Ampere Computing Holdings LLC · Strategic chip supplier and related-party equity/convertible debt investee (~29% ownership); pending acquisition by SoftBank
“investments in Ampere Computing Holdings LLC (Ampere), a privately held related party entity in which we had an ownership interest of approximately 29% as of May 31, 2025... SoftBank Group Corp. announced that it had entered into an agreement... to acquire all of the equity interests of Ampere”
IBM · $258.3B
Red Hat OpenShift: Open hybrid cloud application platform serving as the foundation of IBM's hybrid cloud strategy across on-prem and multicloud environments.
U.S. Federal Government
“The company's customers include numerous governmental entities within and outside the U.S., including the U.S. Federal Government and state and local entities.”
Unnamed sole/limited-source semiconductor supplier(s) for server processor technology · Single or limited source for server processor technology semiconductors
“Certain of the company's businesses rely on a single or a limited number of suppliers, including for server processor technology for certain semiconductors.”
3 reportable companies
TSLA · $1.5T
Model Y: Compact SUV built on the Model 3 platform with seating for up to seven adults; refreshed in 2025 and currently powers the Robotaxi fleet.
xAI · $430M revenue in FY2025 (~0.5% of total)
“During the year ended December 31, 2025, we recognized $430 million of revenues and $285 million of cost of revenues from xAI for its purchase of our Megapack products in the ordinary course of business.”
Panasonic · Key lithium-ion battery cell supplier for vehicles and energy storage
“Currently, we rely on suppliers such as Panasonic and Contemporary Amperex Technology Co. Limited (CATL) for these cells.”
05 / Chokepoints
Advanced packaging converts scarce leading-edge wafers into usable AI accelerators; CoWoS allocation is a direct constraint on GPU and ASIC shipments.
“NVDA secures ~60% of TSMC CoWoS capacity, 515k wafers in 2026”
“TSMC outsourcing CoWoS to ASE and Amkor”
HBM availability determines how many high-end accelerators can be assembled and sold into hyperscale clusters.
“Micron supplies AMD HBM”
“We purchase memory from SK Hynix Inc., Micron Technology, Inc., and Samsung.”
“Micron qualified for NVDA HBM4”
The leading-edge foundry base depends on a single lithography equipment vendor for EUV systems.
“Intel installs industry's first commercial High-NA EUV (Twinscan EXE:5200B) for 14A”
“ASML Holding N.V. (ASML) is currently the sole supplier of EUV lithography tools that we are deploying in our Intel 4, Intel 3, Intel 18A and planned future leading-edge manufacturing process nodes.”
“Samsung 1H26 High-NA EUV mass production”
06 / Demand Risk
| Company | Market Cap | Customer Count | First 3 Major Customers |
|---|---|---|---|
| NVIDIA CorporationNVDA | $5.0T | — | Direct Customer A (undisclosed)22%Direct Customer B (undisclosed)14%OpenAI |
| Taiwan Semiconductor ManufacturingTSM | $2.2T | — | Customer A (largest customer, undisclosed)19%Customer B (second largest, undisclosed)17%Sony Semiconductor Solution Corporation |
| Broadcom Inc.AVGO | $1.8T | — | Unnamed top semiconductor distributor32%Top five end customers (aggregate)~40%KKR & Co. Inc. |
| Advanced Micro DevicesAMD | $796.5B | — | OpenAI OpCo, LLCSony Interactive EntertainmentMicrosoft Corporation |
| Intel CorporationINTC | $587.8B | — | Dell Inc.19%Lenovo Group Limited12%HP Inc.12% |
07 / Custom Silicon
| Hyperscaler | ASIC Partner | Evidence | Source |
|---|---|---|---|
| No hyperscaler-designer partners_with edges in the current graph. | |||
08 / Sources
| Accession Number | Symbol | Filing | Edges |
|---|---|---|---|
| 10-K 0000002488-26-000018 | Unknown | SEC filing | 7 |
| 10-K 0000004127-25-000085 | Unknown | SEC filing | 10 |
| 10-K 0000006281-25-000153 | Unknown | SEC filing | 1 |
| 10-K 0000024741-26-000124 | Unknown | SEC filing | 1 |
| 10-K 0000047217-25-000071 | Unknown | SEC filing | 5 |
| 10-K 0000050863-26-000011 | Unknown | SEC filing | 9 |
| 10-K 0000320193-25-000079 | Unknown | SEC filing | 1 |
| 10-K 0000707549-25-000075 | Unknown | SEC filing | 1 |
| 10-K 0000766421-26-000010 | Unknown | SEC filing | 1 |
| 10-K 0000804328-25-000085 | Unknown | SEC filing | 5 |
| 10-K 0000813672-26-000016 | Unknown | SEC filing | 2 |
| 10-K 0000883241-25-000028 | Unknown | SEC filing | 1 |
| 10-K 0000897723-25-000042 | Unknown | SEC filing | 2 |
| 10-K 0000912093-25-000096 | Unknown | SEC filing | 13 |
| 10-K 0000950170-25-087926 | Unknown | SEC filing | 3 |
| 10-K 0000950170-25-100235 | Unknown | SEC filing | 3 |
| 10-K 0001045810-26-000021 | Unknown | SEC filing | 7 |
| 10-K 0001047127-26-000014 | Unknown | SEC filing | 2 |
| 10-K 0001091667-26-000017 | Unknown | SEC filing | 4 |
| 10-K 0001375365-25-000027 | Unknown | SEC filing | 5 |
| 10-K 0001404912-26-000007 | Unknown | SEC filing | 1 |
| 10-K 0001408710-25-000039 | Unknown | SEC filing | 5 |
| 10-K 0001413447-26-000008 | Unknown | SEC filing | 3 |
| 10-K 0001437749-26-005875 | Unknown | SEC filing | 5 |
| 10-K 0001493594-25-000054 | Unknown | SEC filing | 1 |
| 10-K 0001596532-26-000013 | Unknown | SEC filing | 3 |
| 10-K 0001628280-25-033813 | Unknown | SEC filing | 5 |
| 10-K 0001628280-25-040830 | Unknown | SEC filing | 2 |
| 10-K 0001628280-25-045293 | Unknown | SEC filing | 1 |
| 10-K 0001628280-25-056698 | Unknown | SEC filing | 1 |
| 10-K 0001628280-26-003942 | Unknown | SEC filing | 2 |
| 10-K 0001628280-26-004994 | Unknown | SEC filing | 2 |
| 10-K 0001628280-26-013098 | Unknown | SEC filing | 1 |
| 10-K 0001628280-26-032873 | Unknown | SEC filing | 2 |
| 10-K 0001645590-25-000130 | Unknown | SEC filing | 4 |
| 10-K 0001730168-25-000121 | Unknown | SEC filing | 4 |
| 10-K 0001736297-26-000010 | Unknown | SEC filing | 4 |
| 10-K 0001835632-26-000011 | Unknown | SEC filing | 1 |
| 10-K 0001858681-26-000013 | Unknown | SEC filing | 2 |
| 20-F 0000950123-09-069073 | Unknown | SEC filing | 11 |
| 20-F 0001178913-26-002318 | Unknown | SEC filing | 5 |
| 20-F 0001193125-25-092142 | Unknown | SEC filing | 5 |
| 20-F 0001193125-25-143137 | Unknown | SEC filing | 2 |
| 20-F 0001193125-26-135585 | Unknown | SEC filing | 4 |
| 20-F 0001628280-26-011378 | Unknown | SEC filing | 1 |
| 20-F 0001628280-26-025362 | Unknown | SEC filing | 4 |
| 20-F 0001709048-26-000022 | Unknown | SEC filing | 4 |
| 20-F 0001973239-25-000016 | Unknown | SEC filing | 5 |