EvidInvest Supply Chain Intelligence
AVGO · Chip Designers · asic_networking
Companies that supply Broadcom Inc., from incoming 'supplies' edges and disclosed customer-of relationships.
Packaging (OSAT) · Supplies
“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
Packaging (OSAT) · Supplies
“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
Foundry · Supplies
“During fiscal year 2025, approximately 95% of the wafers manufactured by our CMs were produced by TSMC. We believe our wafer requirements represent a meaningful portion of TSMC's total production capacity.”
Companies that buy from Broadcom Inc., from outgoing 'supplies' edges and disclosed customer-of relationships.
Hyperscalers / Cloud · Customer of
“Google TPU custom design w/ Broadcom (contract through 2031)”
Enterprise / AI Labs · Customer of
“Anthropic relationship cited by Mizuho”
Networking · Supplied by
“we are primarily reliant upon our predominant merchant silicon vendor, Broadcom, for our switching chips.”
Other · Supplied by
“On January 2, 2025, GlobalFoundries Singapore acquired the remaining 51% of the shares in the share capital of SMP from Avago Singapore, thereby making SMP a wholly-owned subsidiary.”
System OEM · Supplied by
“Broadcom and others for industry standard Application-Specific Standard Product”
Other · Customer of
“On July 1, 2024, we sold VMware's end-user computing ("EUC") business to KKR & Co. Inc. for cash consideration of $3.5 billion, after working capital adjustments.”
Hyperscalers / Cloud · Customer of
“Meta MTIA 4 generations co-developed with Broadcom, 1GW deployment”
System OEM · Supplied by
“we closely monitor the product introduction cycles of industry leaders, including NVIDIA Corporation, Intel Corporation, Advanced Micro Devices, Inc., Broadcom Inc.”
Other · Supplied by
“patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and AVAGO.”
Partnerships, IP licensing, competition, investments, and manufacturing relationships.
IP / Architecture · Licenses IP from
“Broadcom Arm licensee”
Chip Designers · Competes with
“Custom ASIC breaking NVDA grip”
Foundry · Fabs at
“11–15% of TSMC revenue”