United Microelectronics Corporation (UMC)

“Advanced Semiconductor Engineering Inc. in Taiwan.”

“patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and AVAGO.”

“Secured Syndicated Loans from China Development Bank and 6 others”

“On December 18, 2024, we entered into a corporate power purchase agreement ('CPPA') with Fengmiao I Offshore Wind Farm ('Fengmiao I'), developed by Copenhagen Infrastructure Partners' flagship fund, Copenhagen Infrastructure V.”

“Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation)”

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group...”

“We have entered into various patent cross-licenses with major technology companies, including a number of leading international semiconductor companies, such as IBM and AVAGO.”

“Other related party... Mask expenditure... 2,285,797 (in NT$ thousands)”

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation) and Soitec.”

“We outsource assembly and test services to leading assembly and test service providers, including Siliconware Precision Industries Co., Ltd., or Siliconware, and Advanced Semiconductor Engineering Inc. in Taiwan.”

“we purchased a majority of our silicon wafers from Shin-Etsu Handotai Corporation, or Shin-Etsu, GlobalWafers, Sumco Group... and Soitec.”

“Sumco Group (including Sumco Corporation and Formosa Sumco Technology Corporation)”

“We also use substantial amounts of dual loop electricity supplied by Taiwan Power Company in the manufacturing process.”

“we utilize TSMC, United Microelectronics Corporation (UMC) and Samsung Electronics Co., Ltd. for the production of our ICs in the form of programmable logic devices.”

“Our largest customer from our wafer fabrication segment accounted for 8.6%, 13.1% and 10.4% of our operating revenues in 2022, 2023 and 2024, respectively.”

“DENSO Corporation, or DENSO, a leading mobility supplier, and USJC announced that the companies have agreed to collaborate on the production of power semiconductors at USJC's 300mm fab”

“We have established foundry relationships with United Microelectronics Corporation (UMC) for 130-nanometer, 90-nanometer and 65-nanometer manufacturing.”

“On January 25, 2024, we entered into a collaboration with Intel Corporation for the purpose of developing a 12nm semiconductor process platform... we currently expect production of 12nm products in 2027.”

“In 2024, we announced a strategic collaboration with UMC to develop a 12 nm process platform that expands our mature-node process portfolio and strengthens our U.S.-based manufacturing foundry capabilities, with production expected to begin in 2027.”

“Our primary customers, in terms of our sales revenues, include premier integrated device manufacturers, such as Texas Instruments and Intel, plus leading fabless design companies, such as MediaTek, Realtek and Novatek.”

“leading fabless design companies, such as MediaTek, Realtek and Novatek.”

“leading fabless design companies, such as MediaTek, Realtek and Novatek.”

“Our primary customers... include premier integrated device manufacturers, such as Texas Instruments and Intel”

“Our top ten customers accounted for 52.4%, 62.0% and 55.6% of our operating revenues in 2022, 2023 and 2024, respectively.”

“Fabless PMIC designer using specialty/BCD foundry capacity (industry research, Jun 2026)”