Amkor TechnologyAMKR
Packaging (OSAT) · Supplies
“For assembly services, we have further intensified our partnership with AMKOR Technology on leadless and flip-chip technologies.”
SEC 20-F 0000950123-09-069073Valuation →
EvidInvest Supply Chain Intelligence
Infineon Technologies AG
IFNNY · Other
$70.97
Price
$92.4B
Market cap
44
Mapped relationships
42
Cited with sources
Suppliers
Companies that supply Infineon Technologies AG, from incoming 'supplies' edges and disclosed customer-of relationships.
cited
ASE Technology HoldingASX
Packaging (OSAT) · Supplies
“We and Advanced Semiconductor Engineering Inc., (ASE) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology.”
SEC 20-F 0000950123-09-069073Valuation →
Chartered Semiconductor Manufacturing
Other · Supplies
“foundry relationships with ... Chartered Semiconductor and Taiwan Semiconductor Manufacturing Company (TSMC) for 65-nanometer manufacturing.”
SEC 20-F 0000950123-09-069073
Freescale Semiconductor
Other · Supplies
“ISDA ... a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor Manufacturing Ltd., Freescale Seminconductor, Inc., NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon.”
SEC 20-F 0000950123-09-069073
GLOBALFOUNDRIES Inc.GFS
Other · Supplies
“International Semiconductor Development Alliance (ISDA), a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor Manufacturing Ltd., Freescale ... and Infineon for CMOS development and manufacturing at 45-nanometer and 32-nanometer process technologies.”
SEC 20-F 0000950123-09-069073Valuation →
IBM CloudIBM
Hyperscalers / Cloud · Supplies
“Our principal alliances are with the International Semiconductor Development Alliance (ISDA), a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor Manufacturing Ltd., Freescale Seminconductor, Inc., NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon for CMOS development and manufacturing at 45-nanometer and 32-nanometer process technologies.”
SEC 20-F 0000950123-09-069073Valuation →
Intel CorporationINTC
Chip Designers · Supplies
“In the security and chip card segment, we entered into new collaborations with Intel. One agreement concerns the development of optimized chip solutions for high-density SIM cards.”
SEC 20-F 0000950123-09-069073Valuation →
LS Industrial Systems
Other · Supplies
“On June 9, 2009, we signed an agreement with LS Industrial Systems Co., Ltd., South Korea, to establish the joint venture LS Power Semitech Co., Ltd., to jointly develop, produce and market molded power modules for low power applications.”
SEC 20-F 0000950123-09-069073
NEC Corporation6701.T
Other · Supplies
“ISDA ... a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor, Freescale Seminconductor, NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon.”
SEC 20-F 0000950123-09-069073
Robert Bosch GmbH
Other · Supplies
“We and Robert Bosch GmbH (Bosch) are widening our cooperation to include power semiconductors. ... Bosch licenses from us certain manufacturing processes for power semiconductors ... the collaboration includes a second-source agreement.”
SEC 20-F 0000950123-09-069073
Samsung005930.KS
Other · Supplies
“We announced a strategic technology collaboration with Micron for the development of high-density subscriber identity module (HD-SIM) cards ... ISDA ... NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon.”
SEC 20-F 0000950123-09-069073
STATS ChipPAC
Other · Supplies
“STMicroelectronics NV, STATS ChipPAC Ltd. and Infineon are jointly developing the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology.”
SEC 20-F 0000950123-09-069073
STMicroelectronicsSTM
Other · Supplies
“STMicroelectronics NV, STATS ChipPAC Ltd. and Infineon are jointly developing the next-generation of embedded Wafer-Level Ball Grid Array (eWLB) technology.”
SEC 20-F 0000950123-09-069073Valuation →
Taiwan Semiconductor ManufacturingTSM
Foundry · Supplies
“We have established foundry relationships with United Microelectronics Corporation (UMC) for 130-nanometer, 90-nanometer and 65-nanometer manufacturing as well as with Chartered Semiconductor and Taiwan Semiconductor Manufacturing Company (TSMC) for 65-nanometer manufacturing.”
SEC 20-F 0000950123-09-069073Valuation →
Taiwan Semiconductor ManufacturingTSM
Foundry · Supplier
“Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors Germany GmbH... each acquired 10% equity interest”
SEC 20-F 0001628280-26-025362Valuation →
Toshiba Corporation6502.T
Other · Supplies
“ISDA ... NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon.”
SEC 20-F 0000950123-09-069073
United Microelectronics Corporation (UMC)UMC
Other · Supplies
“We have established foundry relationships with United Microelectronics Corporation (UMC) for 130-nanometer, 90-nanometer and 65-nanometer manufacturing.”
SEC 20-F 0000950123-09-069073Valuation →
Wolfspeed, Inc.WOLF
Other · Supplies
“SiC substrate wafers (industry research, Jun 2026)”
industry reportValuation →
Customers
Companies that buy from Infineon Technologies AG, from outgoing 'supplies' edges and disclosed customer-of relationships.
ArrowARW
Other · Customer of
“Avnet and Arrow accounting for the highest revenues among our distribution partners.”
SEC 20-F 0000950123-09-069073Valuation →
ASE Technology HoldingASX
Packaging (OSAT) · Supplied by
“We have also entered into various non-exclusive technology license agreements with other companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc.”
SEC 20-F 0001193125-26-135585Valuation →
AutolivALV
Other · Customer of
“Autoliv — the world's largest supplier of automotive safety systems — selected us as the sole supplier of power semiconductors for its next-generation seatbelt pretension systems, called Active Seatbelts.”
SEC 20-F 0000950123-09-069073Valuation →
AvnetAVT
Other · Customer of
“A significant portion of our automotive sales came from the distribution channel, with Avnet and Arrow accounting for the highest revenues among our distribution partners.”
SEC 20-F 0000950123-09-069073Valuation →
ContinentalCON.DE
Other · Customer of
“Our two largest customers in the 2009 fiscal year were Bosch and Continental.”
SEC 20-F 0000950123-09-069073
Delphi
Other · Customer of
“Automotive ... Avnet, Bosch, Continental, Delphi.”
SEC 20-F 0000950123-09-069073
Delta2308.TW
Other · Customer of
“Industrial & Multimarket ... Avnet, Delta, Siemens, WPG Holdings.”
SEC 20-F 0000950123-09-069073
EricssonERIC
Other · Customer of
“We supply RF-power products to wireless infrastructure customers such as Ericsson.”
SEC 20-F 0000950123-09-069073Valuation →
Foxconn Hon Hai2317.TW
Other · Customer of
“Significant Customers in the 2009 Fiscal Year ... Wireless Solutions ... Hon Hai Precision, LG Electronics, Nokia, Samsung.”
SEC 20-F 0000950123-09-069073
GemaltoGTOMY
Other · Customer of
“three card manufacturers — Gemalto, Giesecke & Devrient and Oberthur Card Systems — currently account for a significant portion of sales.”
SEC 20-F 0000950123-09-069073Valuation →
Giesecke & Devrient
Other · Customer of
“three card manufacturers — Gemalto, Giesecke & Devrient and Oberthur Card Systems — currently account for a significant portion of sales.”
SEC 20-F 0000950123-09-069073
LG Electronics066570.KS
Other · Customer of
“Our largest announced cellular phone customers include LG Electronics, Nokia and Samsung.”
SEC 20-F 0000950123-09-069073
Marvell TechnologyMRVL
Chip Designers · Supplied by
“On August 14, 2025, we completed the sale of our automotive ethernet business to Infineon Technologies AG for $2.5 billion in cash.”
SEC 10-K 0001835632-26-000011Valuation →
Microsoft CorporationMSFT
Hyperscalers / Cloud · Customer of
“We concentrate on customized designs for customers such as Siemens and Microsoft Corporation.”
SEC 20-F 0000950123-09-069073Valuation →
NokiaNOK
Other · Customer of
“We and Nokia entered into a collaboration for Enhanced Data rate for GSM Evolution (EDGE) technology. We will supply our XMM 2130 EDGE platform to Nokia... ramp-up of single-chip mobile phone platforms at Nokia and other major customers.”
SEC 20-F 0000950123-09-069073Valuation →
NVIDIA CorporationNVDA
Chip Designers · Supplied by
“Global #1 power-semi; power delivery for AI servers (industry research, Jun 2026)”
industry reportValuation →
NXP Semiconductors N.V.NXPI
Other · Supplied by
“ESMC is 70% owned by TSMC, with Bosch, Infineon, and NXP each owning 10%.”
SEC 10-K 0001413447-26-000008Valuation →
Oberthur Card Systems
Other · Customer of
“three card manufacturers — Gemalto, Giesecke & Devrient and Oberthur Card Systems — currently account for a significant portion of sales.”
SEC 20-F 0000950123-09-069073
Robert Bosch GmbH
Other · Customer of
“Our two largest customers in the 2009 fiscal year were Bosch and Continental... We signed a collaboration contract with Bosch under which we will license to Bosch certain manufacturing processes for power semiconductors.”
SEC 20-F 0000950123-09-069073
Samsung005930.KS
Other · Customer of
“Our largest announced cellular phone customers include LG Electronics, Nokia and Samsung.”
SEC 20-F 0000950123-09-069073
SiemensSIEGY
Other · Customer of
“In the Industrial & Multimarket segment, the Siemens group is the largest OEM customer.”
SEC 20-F 0000950123-09-069073Valuation →
Top 25 customers (aggregate)
Other · Customer of
“No single customer accounted for more than 10 percent of our revenues in the 2009 fiscal year, while our top 25 customers accounted for 72 percent of our revenues.”
SEC 20-F 0000950123-09-069073
ToyotaTM
Other · Customer of
“The Hirose plant of the car manufacturer Toyota awarded us the Best of Excellent Quality Award 2009 for our extraordinary product quality.”
SEC 20-F 0000950123-09-069073Valuation →
Two related Wireless Solutions customers (unnamed)
Other · Customer of
“Our Wireless Solutions segment derived 27 percent of its revenues from two related customers.”
SEC 20-F 0000950123-09-069073
U.S. Government Printing Office
Other · Customer of
“Other than the card manufacturers, our customer base includes secure printers, such as the U.S. Government Printing Office.”
SEC 20-F 0000950123-09-069073
WPG Holdings3702.TW
Other · Customer of
“served directly or through third-party distributors such as Arrow, Avnet and WPG Holdings.”
SEC 20-F 0000950123-09-069073
Other relationships
Partnerships, IP licensing, competition, investments, and manufacturing relationships.
No other relationships mapped yet.