Infineon Technologies AG

“For assembly services, we have further intensified our partnership with AMKOR Technology on leadless and flip-chip technologies.”

“We and Advanced Semiconductor Engineering Inc., (ASE) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology.”

“International Semiconductor Development Alliance (ISDA), a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor Manufacturing Ltd., Freescale ... and Infineon for CMOS development and manufacturing at 45-nanometer and 32-nanometer process technologies.”

“Our principal alliances are with the International Semiconductor Development Alliance (ISDA), a technology alliance among IBM, GlobalFoundries Inc., Chartered Semiconductor Manufacturing Ltd., Freescale Seminconductor, Inc., NEC Corporation, Samsung Electronics Ltd., STMicroelectronics NV, Toshiba Corporation and Infineon for CMOS development and manufacturing at 45-nanometer and 32-nanometer process technologies.”

“In the security and chip card segment, we entered into new collaborations with Intel. One agreement concerns the development of optimized chip solutions for high-density SIM cards.”

“We have established foundry relationships with United Microelectronics Corporation (UMC) for 130-nanometer, 90-nanometer and 65-nanometer manufacturing as well as with Chartered Semiconductor and Taiwan Semiconductor Manufacturing Company (TSMC) for 65-nanometer manufacturing.”

“Robert Bosch GmbH, Infineon Technologies AG, and NXP Semiconductors Germany GmbH... each acquired 10% equity interest”

“We have established foundry relationships with United Microelectronics Corporation (UMC) for 130-nanometer, 90-nanometer and 65-nanometer manufacturing.”

“We have also entered into various non-exclusive technology license agreements with other companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc.”

“We supply RF-power products to wireless infrastructure customers such as Ericsson.”

“On August 14, 2025, we completed the sale of our automotive ethernet business to Infineon Technologies AG for $2.5 billion in cash.”

“We concentrate on customized designs for customers such as Siemens and Microsoft Corporation.”

“We and Nokia entered into a collaboration for Enhanced Data rate for GSM Evolution (EDGE) technology. We will supply our XMM 2130 EDGE platform to Nokia... ramp-up of single-chip mobile phone platforms at Nokia and other major customers.”

“ESMC is 70% owned by TSMC, with Bosch, Infineon, and NXP each owning 10%.”

“The Hirose plant of the car manufacturer Toyota awarded us the Best of Excellent Quality Award 2009 for our extraordinary product quality.”