Advantest Corporation6857.T
Other · Supplies
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”
SEC 20-F 0001193125-26-135585
EvidInvest Supply Chain Intelligence
ASE Technology Holding
ASX · Packaging (OSAT) · osat_packaging
$36.55
Price
$80.2B
Market cap
25
Mapped relationships
25
Cited with sources
Suppliers
Companies that supply ASE Technology Holding, from incoming 'supplies' edges and disclosed customer-of relationships.
cited
Ajinomoto2802.T
Other · Supplies
“the Ajinomoto Build-up Film (ABF) substrate, a crucial component for manufacturing high-performance chips, may face a higher risk of supply shortages or extended lead times due to potential strong demand for AI, elevated manufacturing difficulty, and heavy capital requirements for capacity expansion.”
SEC 20-F 0001193125-26-135585
All Ring Tech Co., Ltd.6187.TWO
Other · Supplies
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”
SEC 20-F 0001193125-26-135585
DECA Technologies Inc.
Other · Supplies
“We have also entered into various non-exclusive technology license agreements with other companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc.”
SEC 20-F 0001193125-26-135585
Grand Process Technology Corporation
Other · Supplies
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”
SEC 20-F 0001193125-26-135585
Infineon Technologies AGIFNNY
Other · Supplies
“We have also entered into various non-exclusive technology license agreements with other companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc.”
SEC 20-F 0001193125-26-135585Valuation →
Kinsus Interconnect Technology Corporation3189.TW
Other · Supplies
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”
SEC 20-F 0001193125-26-135585
Lam Research CorporationLRCX
Other · Supplies
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”
SEC 20-F 0001193125-26-135585Valuation →
Marketech International Corp.6196.TW
Other · Supplies
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”
SEC 20-F 0001193125-26-135585
Nan Ya Printed Circuit Board Corporation8046.TW
Other · Supplies
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”
SEC 20-F 0001193125-26-135585
TDK Corporation6762.T
Other · Supplies
“We have also entered into various non-exclusive technology license agreements with other companies involved in the semiconductor manufacturing process, including Infineon Technologies AG, TDK Corporation, and DECA Technologies Inc.”
SEC 20-F 0001193125-26-135585
Teradyne, Inc.TER
Other · Supplies
“We purchase testers from major international manufacturers, primarily Teradyne, Inc., Tokyo Electron Limited, and Advantest Corporation.”
SEC 20-F 0001193125-26-135585Valuation →
Tokyo Electron Limited8035.T
Other · Supplies
“We purchase our packaging equipment from major international manufacturers, including All Ring Tech Co., Ltd., Marketech lnternational Corp., Grand Process Technology Corporation, Tokyo Electron Limited, and Lam Research Corporation.”
SEC 20-F 0001193125-26-135585
Unimicron Technology Corporation3037.TW
Other · Supplies
“Raw materials such as IC substrates are prone to supply shortages since such materials are produced by a limited number of suppliers, such as Kinsus Interconnect Technology Corporation, Nan Ya Printed Circuit Board Corporation, and Unimicron Technology Corporation.”
SEC 20-F 0001193125-26-135585
Customers
Companies that buy from ASE Technology Holding, from outgoing 'supplies' edges and disclosed customer-of relationships.
Astera Labs, Inc. Common StockALAB
Networking · Supplied by
“We use Advanced Semiconductor Engineering and Amkor Technologies to assemble, package, and test our ICs.”
SEC 10-K 0001736297-26-000010Valuation →
Broadcom Inc.AVGO
Chip Designers · Supplied by
“We use third-party CMs for a significant majority of our assembly and test operations, including TSMC, Advanced Semiconductor Engineering, Inc., Foxconn Technology Group, Amkor Technology, Inc. and Siliconware Precision Industries Co., Ltd.”
SEC 10-K 0001730168-25-000121Valuation →
Credo Technology Group Holding LtdCRDO
Networking · Supplied by
“Amkor Technology Inc. (Amkor) and Advanced Semiconductor Engineering, Inc. (ASE) for packaging our IC products”
SEC 10-K 0001628280-25-033813Valuation →
Infineon Technologies AGIFNNY
Other · Supplied by
“We and Advanced Semiconductor Engineering Inc., (ASE) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology.”
SEC 20-F 0000950123-09-069073Valuation →
QualcommQCOM
Chip Designers · Supplied by
“Our primary semiconductor assembly and test suppliers are Advanced Semiconductor Engineering, Amkor Technology, Siliconware Precision Industries and STATSChipPAC.”
SEC 10-K 0000804328-25-000085Valuation →
Taiwan Semiconductor ManufacturingTSM
Foundry · Customer of
“Since 1997, we have maintained a strategic alliance with Taiwan Semiconductor Manufacturing Company Limited, or TSMC... TSMC designates us as its non-exclusive preferred provider of packaging and testing services for semiconductors manufactured by TSMC.”
SEC 20-F 0001193125-26-135585Valuation →
Top five customers (aggregate)
Other · Customer of
“Our five largest customers together accounted for approximately 48.0%, 48.4% and 46.5% of our operating revenues in 2023, 2024, and 2025, respectively.”
SEC 20-F 0001193125-26-135585
Undisclosed >10% customer (Customer One)
Other · Customer of
“One customer (including other customers for whom OEM services were provided on its behalf) accounted for more than 10.0% of our operating revenues in 2023, 2024, and 2025.”
SEC 20-F 0001193125-26-135585
United Microelectronics Corporation (UMC)UMC
Other · Supplied by
“Advanced Semiconductor Engineering Inc. in Taiwan.”
SEC 20-F 0001193125-25-092142Valuation →
Other relationships
Partnerships, IP licensing, competition, investments, and manufacturing relationships.
NVIDIA CorporationNVDA
Chip Designers · Packages chips for
“NVDA enlists Amkor and ASE for 80k additional wafers”
Taiwan Semiconductor ManufacturingTSM
Foundry · Partners with
“TSMC outsourcing CoWoS to ASE and Amkor”